I would appreciate some guidance on a subject that could be of interest
to others in the same dilemma.

We are specifying controls for unpopulated PWB's to be used in low
residue/no clean process.  We plan to restrict bare board bulk ionic
levels to no more than 2 micrograms/sq.in. NaCl equivalent.   Also, it
has been suggested that we require that 'polyethylene glycol substances,
as well as certain dry film and even some liquid photoimageable masks be
avoided'.  The bulk ionic requirement is easy to communicate but I am
struggling with the verbiage and test methods that describe restrictions
on polyethylene glycol substances and other potentially harmful
materials. 

Any help in this matter will be greatly appreciated.

Mary Davis
Sr. Material & Process Engineer
Hughes Aircraft
Naval & Maritime Systems
206-356-3311
[log in to unmask]


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