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March 1997

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From:
[log in to unmask] (Dave Willhard)
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Date:
Mon, 3 Mar 1997 11:58:13 PST
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We've found the implementation of SPC to be difficult in our circuit
board manufacturing facility.  Due to the wide of variety of board
designs we produce, I think the best way to use valid SPC techniques would
be to use a standard test panel.  The dissadvantage is that this can be
somewhat expensive and intrusive into normal prod'n (you have to stop
running normal product so the test panel can be run).

Another option is to use standard test patterns that can be printed on the border
of regular production panels.  This also has a disadvantage since
we've found that patterns on the borders of the panel often come out
of a process with different characteristices than features on the
interior area of the panels.  For example, for controlling line widths
in etching processes, we've tried to use test patterns (since different
lots will have different line width specs) but have found that due to 
spray pressures, circuitry density, etc. the measurements taken on the 
panel border don't necessarily correlate well with actual circuit measruements.

If anyone has struggled with these problems, we would appreciate some
information.

My E-mail address is [log in to unmask]

Thanks!

Dave Hall

P.S. - I submitted a request for information on HAL SPC several days ago and received
some very helpful responses.  Thanks!


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