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Subject:	Re: dimensional stability
From:	Bill Marsh <[log in to unmask]>
Date:	Mon, 10 Mar 1997 14:51:41 -0800 (PST)
Content-Type:	text/plain
Parts/Attachments:	text/plain (47 lines)

You gotta have stress relief - see Appendix C of J-STD-001B

>Dimensional stability -- a related question ... does anyone have experience
>with staking high profile components [leaded devices, installed in plated
>thru holes, leads cinched over on the back side of the board]? We are
>thinking of staking with an epoxy adhesive.  We are trying to find a way to
>secure the components to keep the thermal movement of the encapsulant from
>pulling the parts out of the boards.  Any similar experiences?
>
>Related to the original question about using strain gauges, have you
>considered thermomechanical analysis for looking at the behavior of your
>typical materials @ reflow temperatures?  TMA measures dimensional changes
>over temperature and can be used from -160 to 1200C.  It is very useful for
>determining Tg & CTE also.  If you contact me directly, I can furnish names
>of several labs that do TMA.
>
>S. Smith
>Tracor Aerospace Electronic Systems
>
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Bill Marsh
Phone: 415-604-6979
e-mail: [log in to unmask]


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