I am trying to determine reasonable parameters in my pre plate cleaning 
operation.
The first thing I need is a way to check the performance of the cleaning 
solution.  We recently had a bath go bad early but it met all the tests we 
were doing.  We check with a titration method recommended by the vendor as 
well as a specific gravity check.
The other thing I would like to know is what is a reasonable amount of copper 
to remove during a micro-etch process.  Also what would be the maximum that 
would be expected to be removed.  We currently run between 25 and 50 
microinches per minute with a two minute cycle.

Any suggestions would be greatly appreciated.

Bob Peterson 

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