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March 1997

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Subject:
Photo Via
From:
"Scott B. Westheimer" <[log in to unmask]>
Date:
Wed, 19 Mar 1997 21:06:07 +0800
Content-Type:
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From: Scott Westheimer
Date: 3/19/97

We are working with Ciba's epoxy and building Photovia's. We have
encountered a strange problem with the plated copper over the epoxy. The
peel strengths over laminate areas are better than the peel strengths over
oxided copper areas. Have any of you, that are either using or are
evaluating this process, encountered the same? Also we see that KMno4
attack is inconsistent. Same time temperature and concentration and
processed the same way. Any information on this and how you are running in
production would be helpful.

Thanks,

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