 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0w9YzW-000BjbC; Tue, 25 Mar 97 10:22 CST |
| Content-Type: |
text/plain; charset=ISO-8859-1 |
| Old-Return-Path: |
|
| Date: |
Tue, 25 Mar 1997 10:34:14 -0600 |
| MIME-version: |
1.0 |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| From [log in to unmask] Tue Mar 25 11: |
39:56 1997 |
| TO: |
|
| Return-Path: |
<TechNet-request> |
| Resent-Message-ID: |
<"GMGA6.0.yLG.5l_Dp"@ipc> |
| Subject: |
|
| From: |
|
| X-Loop: |
|
| Content-transfer-encoding: |
quoted-printable |
| X-Mailer: |
TFS Gateway /220000000/220020001/220000514/220100066/ |
| Message-Id: |
|
| Parts/Attachments: |
|
|
TechNet,
I have a black and white version of MIL-STD-750D which has several
pictorials of solderability issues such as porosity, non-wetting,
pinholes, dewetting and foreign material. They are figures 2026-3,
2026-4, 2026-5, 2026-6 and 2026-7 in that standard. I would be
interested in obtaining a color version of this standard or pictures
which can be placed into a guide in regard to solderability of
component leads. Can anyone help me in this regard??
Thanks for your time!!
Dwight Nolen
Manfacturing Quality Engineer/QA Supervisor
Frontier Engineering
Stillwater, Oklahoma
405-624-5329
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
* with <subject: subscribe/unsubscribe> and no text in the body. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
|
|
|
