Since IPC-6012 does not require evaluation before thermal stress and even
directs the fabricator to evaluate his  microsections after thermal stress
and HASL comes before thermal stress, resin recession after HASL is not a
condition that needs to be evaluated per the IPC specification.  As for the
55110, the  microsection required before thermal stress will often turn up
resin recession if the board has been HASLed and is often rejected for what
many of us think is a cosmetic condition, not even a cosmetic defect. .

Phil Hinton 

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