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Date: | Sun, 23 Mar 1997 23:20:22 EST |
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Jenni,
A company that might be able to help you is:
Circuit Repair Corporation
108 Turnpike
Rowley, MA, 01969, USA
Phone: 508-948-7973
Fax: 508-948-2365
Ed Wong
Wongtronics Labs
On Wed, 19 Mar 1997 10:51:05 -0700 "Marcy, Jenni A"
<[log in to unmask]> writes:
>We are about to embark on using microvia or sequential build-up
>technology
>to put small vias in the surface mount pads on our boards. Part of
>our
>qualification process entails understanding the reworkability of the
>boards
>which contain Dycostrate/PERL technology. We have detected pad
>lifting
>after 3 rework cycles, however the lifting is not so substantial as to
>
>require re-epoxying. The pad would likely be trimmed and replaced.
>Has
>anyone out there established guidelines for the extent of pad lifting
>before relabiltiy and/or quality is impacted? Is anyone else
>experiencing
>pad lifting with these technologies.? Thanks in advance.
>Jenni Marcy
>Sr. Sourcing Engineer
>Storage Technology Corp.
>Louisville, Colorado
>
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