Hello Techneters,
Is there any difference between these 2 finishing methods as far as
solderability is concerned ? We use multilayer boards ( up to 14 layers,
densely populated with up to 19 BGA`s on a board. I am concerned about
this issue. Maybe Immersion Gold would have been the best choice ?
How about conductivity in via´s (IC-testing ) ?
Thanks in advance. Every comments are highly appreciated.
Brs
[log in to unmask]
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
* with <subject: subscribe/unsubscribe> and no text in the body. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************