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Date: | Mon, 17 Mar 1997 22:49:23 +0800 |
Content-Type: | text/plain |
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To all technet users ,
Quite often I experience copper crystallization in the acid copper bath which
results in plating distribution problem .Apart from the several factors that
affect this crystallisation -fluctuating current , concentration of the
bath , anode bag , anode basket etc -maybe someone would like to share more
on this problem and how to overcome this in the plating line.
Thanks .
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