I am trying to determine reasonable parameters in my pre plate cleaning
operation.
The first thing I need is a way to check the performance of the cleaning
solution. We recently had a bath go bad early but it met all the tests we
were doing. We check with a titration method recommended by the vendor as
well as a specific gravity check.
The other thing I would like to know is what is a reasonable amount of copper
to remove during a micro-etch process. Also what would be the maximum that
would be expected to be removed. We currently run between 25 and 50
microinches per minute with a two minute cycle.
Any suggestions would be greatly appreciated.
Bob Peterson
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