There were also several papers on this subject presented at a session I
chaired at Surface Mount International, I think it was '95. Check with
David Gonnerman at Surface Mount Technology Assoc HQ, 612-920-7682 to
order.

 >The information may be old but two papers were presented at the 1983
>NEPCON West.  One was titled "How much gold is enough for electronic
>interconnections" by Will Reyes at Xerox. The other was "Palladium-
>Nickel as an alternative to Gold in connector applications" by Undegraff
>and Graham at du Pont.  Some data regarding porosity, HNO3 testing,
>contact resistance, etc is included in the papers.  I would be happy to
>share this information with you if you feel it is of any use.
> ----------
>From: es500yap@pts7
>To: [log in to unmask]
>Subject: FAB: Palladium Plating
>Date: Friday, March 07, 1997 5:00AM
>
>
>
>Does any have any experience with Pd plating replacing Selective Au &
>ENIG
>on
>PWB?  Are there any success stories? Is there any data collected on the
>reliability of this plating? What is the plating thickness like for Ni,
>Pd?
> Is
>Au in the content?  If yes, how much?
>
> Appreciate any input.
>
>
> regards,
> stella
>
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