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   TO:         14235700 IBMMAIL   IBM Mail exchange

   FROM:       DWALLACE EX2       D.Wallace        - Process Control Mngr Dunsdale

   DATE:       6 March 1997
   SUBJECT:    Mylar removal on inners.

    I am trying to obtain some user experience on mylar removal from
    Multilayer Innerlayers prior to Develop / Etch / Strip.

    Is there equipment available that can handle core thicknesses down
    to 0.002"? If not, what is the minimum core thickness that can be
    accommodated?

    Ideally, I would want this equipment to operate at 3.5 Metres /
    minute (minimum).

    What method of removal is favoured?

    Any input will be greatly appreciated.

    David H Wallace
    Process Control Manager.
    Exacta Circuits Limited.

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