----------
> From: Steve <[log in to unmask]>
> To: [log in to unmask]
> Subject: Copper Peel Strength on microvia - dielectrics
> Date: Monday, March 24, 1997 8:01 PM
>
> Hi,
>
> What is the best way to maximize Cu peel on dielectrics used in
sequential
> bulid on microvia designs? We are testing several dielectric materials
in
> dry film and liquid applications. We find plasma helps but feel ther are
> other methods that are less expensive and more conducive to productivity.
>
> Thank you - Steve
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