 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0w916o-000BBnC; Sun, 23 Mar 97 22:11 CST |
| From [log in to unmask] Mon Mar 24 06: |
13:23 1997 |
| Date: |
Sun, 23 Mar 1997 23:20:22 EST |
| Precedence: |
list |
| Resent-From: |
|
| Cc: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| X-Loop: |
|
| X-Juno-Line-Breaks: |
0-12,14-51 |
| Old-Return-Path: |
|
| Resent-Message-ID: |
<"KNP8P2.0.Qi5.1yVDp"@ipc> |
| Subject: |
|
| From: |
|
| References: |
|
| Message-ID: |
|
| X-Mailer: |
Juno 1.15 |
| Resent-Sender: |
|
| Parts/Attachments: |
|
|
Jenni,
A company that might be able to help you is:
Circuit Repair Corporation
108 Turnpike
Rowley, MA, 01969, USA
Phone: 508-948-7973
Fax: 508-948-2365
Ed Wong
Wongtronics Labs
On Wed, 19 Mar 1997 10:51:05 -0700 "Marcy, Jenni A"
<[log in to unmask]> writes:
>We are about to embark on using microvia or sequential build-up
>technology
>to put small vias in the surface mount pads on our boards. Part of
>our
>qualification process entails understanding the reworkability of the
>boards
>which contain Dycostrate/PERL technology. We have detected pad
>lifting
>after 3 rework cycles, however the lifting is not so substantial as to
>
>require re-epoxying. The pad would likely be trimmed and replaced.
>Has
>anyone out there established guidelines for the extent of pad lifting
>before relabiltiy and/or quality is impacted? Is anyone else
>experiencing
>pad lifting with these technologies.? Thanks in advance.
>Jenni Marcy
>Sr. Sourcing Engineer
>Storage Technology Corp.
>Louisville, Colorado
>
>***************************************************************************
>* TechNet mail list is provided as a service by IPC using SmartList
>v3.05 *
>***************************************************************************
>* To subscribe/unsubscribe send a message <to:
>[log in to unmask]> *
>* with <subject: subscribe/unsubscribe> and no text in the body.
> *
>***************************************************************************
>* If you are having a problem with the IPC TechNet forum please
>contact *
>* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]
> *
>***************************************************************************
>
>
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
* with <subject: subscribe/unsubscribe> and no text in the body. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
|
|
|
