I'm Investigating mechanical failures (cracking) of solder joint for   
J-leaded surface mounted components (SOJ).  The primary casue is due to   
the CTE mismatch between the PWB and the cermic SOJ.

Any sources of information for the following?

Stress/Strain relationship of eutectic solder (63 Sn, 37 Pb)

Any alternatives for mounting these J-leaded devices using the same   
footprint?

Any similar experiences to this type of problem and how was it solved?

Hans Ohman
Mechanical Engineering
DY4 Systems Inc.
Kanata, Ontario

[log in to unmask]
613 599 9199 x536

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