To those who have heard enough of this subject I send my deepest apologies,
but to those who still have some energy left to help a double 'E', who has
found himself doing a lot of PCB design lately, I need to try to obtain
some information on Gold Embrittlement.

My question is: 

Can SMT components be attached to PCB's, which are fabricated using 50
micro inch 'Hard Cobalt Gold' over 200 micro inch low stress nickle,
without having to worry about Gold Embrittlement, and if so, are there any
special process steps which need to performed or monitored. We are using a
mixed bag of SMT packages with 1mm pitch being the finest.

I have encountered conflicting data on this subject so far.

Thank you
Tom Guerriere
Staff Engineer
Controlotron Corporation
(516) 231-3600 x81
[log in to unmask]


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