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Hi friends,
In order to make high produceability in the soldering process of boards,
it is necessary to prepare the gold plated components before assembly. This is
stated in ANSI/J-STD-001, which does not allow any gold at all on the component legs.
Is it, anyway, possible to specify a limit of gold thickness on the comp. connections, below which
it is not necessary to extract the gold before soldering? Does anyone have a opinion
about that?
Sven-Eric Backstrom
Ericsson Saab Avionics
Sweden
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