i am building a cavity pcb that requires a layer of soldermask inside the
cavity, also the SMT pads that are inside the cavity are to be gold plated
(electroless gold).

this board is built with a sequential lamination process so i have to
laminate a surface that has FR4, lpi and copper (or gold).  my standard
process to promote adhesion before pressing is a brown oxide treatment but
i am having a lot of problems because the oxide chemistry is attacking the
lpi leaving residue on SMT pads.

i would appreciate any help that anybody could provide me on this subject

thanks

amv.

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