IPC is please to announce our cooperative participation with the European
Institute for Printed Circuits, and the Printed Circuit Industries
Federation to co-sponsor the sixth Joint European Conference in Florence
in June of 1997. Individuals interested in presenting a paper are
requested to complete the form included and forward an abstract to one of
the host sponsors.
Thank you for your interest
Regards
__________________________________________________
David W. Bergman, V.P. of Technical Programs
IPC
2215 Sanders Road
Northbrook, IL 60062-6135
847-509-9700 x340 Phone
847-509-9798 Fax
email [log in to unmask]
www http://www.ipc.org
faxback support 800-646-0089
---------------------------------------------------
European Joint Conference VI
Florence, June 16-17-18, 1997
Technology and Business Strategies for the Next Five Years:
The Successful PWB Company.
CALL FOR PAPERS
Where will your company be in five years? The EIPC, PCIF
and IPC are pleased to host the sixth joint European
Conference at the Sheraton Hotel in Florence to help you
find out. The theme of this years event is to bring
technology as well as management presentations that will
provide tools to help the PCB industry be more successful
over the next five years. Presentations are solicited that
will fit with the program schedule shown below. The
conference will include two full days of presentations and
panel discussions. Attendees are also encouraged to stay
Wednesday to attend the Modena Exhibition.
Planned Program
Monday June 16
Morning
Semiconductor and Interconnect Drivers
Afternoon
Marketing and Management Tools for the Next 5 Years
Tuesday June 17
Morning
Microvia Technology, The Next Generation of PWBs
Afternoon
Workshops
Meeting Your Customers challenges for Surface
Finishes
Managing Small and Medium PWB Companies: Key
Success Factors
Panel Discussions
Five Ways to replace FR-4 - High Performance Low
Cost Options
Bare Board Test - Can you still afford it?
Wednesday June 18
Visit of Modena Exhibition
The Place
EJC VI will take place in Florence. A wide range of social
events including a pre-conference weekend and a spouses
programme will be organized in parallel. The Sheraton is
located a few minutes only from the center, which makes it
very easy for accompanying persons to take full advantage of
this magnificent city, symbol of European renaissance.
Tours will include a wine tour in the Chianti vineyards and
a visit of Toscana’s jewel city of San Giminiano.
The conference will be linked to a visit of the Modena
Exhibition in Florence.
Modena Exhibition Details
Each year in Modena, the Italian PCB industry meets for an
exhibition which has now become a well-established
tradition. Its reputation goes well beyond the borders of
Italy, attracting visitors from all over Europe.
Participants to the EJC VI in Florence who chose to stay for
an additional day will be transfered by shuttle to Modena
(1 hour), where they will be hosted all day by the show
management. The day will include a visit to the show and a
tour of the Ferrari museum, as well as a dinner at the
Europa Club Pavarotti.
Speakers to EJC VI are, as usual, offered free access to the
conference, Gala dinner, proceedings and one hotel night.
How to submit a paper.
Please send title and abstract (500 words maximum) to your
sponsoring organization office.
Deadline
Deadline for abstracts is February 10, 1997
Deadline for submission of final Camera Ready paper to the
EIPC office is May 1, 1997.
ABSTRACT FOR EUROPEAN JOINT CONFERENCE VI
“Technology and Business Strategies for the Next Five Years:
The Successful PWB Company.”
Company:
............................................................
................................................
Address/Tel/Fax:
............................................................
................................................
Name of Speaker:
............................................................
................................................
Title of Paper:
............................................................
................................................
Abstract: (you may use additional space if necessary)
............................................................
............................................................
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............................................................
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Please return to your sponsoring organization by February
10, 1997
EIPC
European Institute of Printed Circuits Tel: ++ 41 61
482 39 00
Hegenheimermattweg 65 Fax: ++ 41 61 482 39
10
Postfach 610, Allschwil CH-4123
IPC
Institute for Interconnecting and Tel: ++1 847
509 9700
Packaging Electronic Circuits Fax: ++1 847 509
9798
2215 Sanders Road
USA Northbrook, IL 60062-6135
PCIF
Printed Circuit Interconnection Federation Tel: ++44
171515 1166
45 Beaufort Court, Admirals Way, South Quay Fax:++44 171
515 1188
UK - E14 9XL London
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