Hello

Does anyone have experience trying to control the height of an LCC 
(leadless) off the board.  I have drawing requirements of .008".
The components are ceramic and are on both sides of the board.
The board is mixed technology and extremely dense.  It also has a 
.062" heatsink (plate) on the top side. Top side printing is out of 
the question.

The volumes are low (about 80)
LCC component count is about 30 per board
The design is fixed (no chance in He** of changing
Spec 's are Military ie..2000

I have tried to locate water/solvent soluable waffers with no luck (.008")
Hand soldering with a spacer is not my preffered option either

Any recomendations would be appriciated

Thanks in advance

Wesley Samples
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(817)  234-6842

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