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February 1997

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Subject:
Re: Chip scale packaging
From:
Lindgren Mats <[log in to unmask]>
Date:
Mon, 3 Feb 1997 15:01:00 +0100
Content-Type:
text/plain
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IVF in Sweden has information about Sequential Build-Up boards (SBU) and
Chip Scale Packaging (CSP). Please contact us for further information,
or check our website, http://www.ivf.se/ep.

Mats Lindgren (SBU boards)		Katarina Boustedt (CSP)
email [log in to unmask]				email [log in to unmask]
phone +46 31 706 6038			phone +46 706 6141

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