TECHNET Archives

February 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Date:
Wed, 5 Feb 97 16:33: 2 PST
Content-Type:
text/plain
Parts/Attachments:
text/plain (27 lines)
Hello all,

I hope there are some of you who are doing business with subcontractors on electronic board 
assemblies and have experience to share?

1. What kind of TECHNICAL competence do I need in my organization (do I need understanding in 
packaging technology, printed board and printed board assembly technology and manufacturing 
processes etc)?

2. What are the most often discussed issues between customer and subcontractor? (I assume there 
is a lot). 

Hans Bogren 
Ericsson Infocom Systems

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************



ATOM RSS1 RSS2