Here's one for the metallurgist. I have been unable to locate a 
     Pb93.5/Sn5/Ag1.5 (305C liquidus; 309C solidus) ternary phase diagram 
     to date. I have been told that one of the technical issues is simply 
     soldering to SnPb plated and/or SnPb hot-dipped coated components with 
     this PbSnAg solder will realize a drop in the melting point. My 
     question is how much ? Assuming, for instance a lead finish 
     composition of Sn63/Pb37 with solder coat thickness of 3 to 4 mils or 
     a CERDIP package with leads that are 100% Sn electroplated (200 to 
     500micons).
     
     
     
     
     


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