Hi to all,

I am working in the "Physical Board Design" Dept. and responsible
for PCB and Boardtechnology.

Now I like to start investigations for the new upcoming
Chip scale packaging technology.
I am looking especially for new and further requirements to realize
this all for new PCB-technologies.
	- DYCOstrate ???
	- Micro Vias ???
	- Laser-drilling ???
	- New Build Up technology ???

Is there anyone in the world who has experience in this area, or is
working on this topic???

Any input will be appreciated,   Thanks for the help in advance
-- 
Werner Wiemers			email:	[log in to unmask]
SNI OEC ES DB 3			Tel.:	+49 5251 820386	
Physical Board Design		Fax:	+49 5251 831087
PCB- and Boardtechnology	Intranet: http://fozzy.pdb.sni.de/workarea/board_1

Heinz-Nixdorf-Ring 1
D-33106 Paderborn
Germany

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