TECHNET Archives

February 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Pulse plating acid copper solutions.Response
From:
[log in to unmask]
Date:
Wed, 5 Feb 1997 08:58:59 -0500 (EST)
Content-Type:
text/plain
Parts/Attachments:
text/plain (22 lines) 
Yes Pulse delivers the goods:
Better surface distribution on pattern plate.
Better throwing power without resorting to low ASF plating.
For additional info e-mail me: [log in to unmask]
George Milad
LeaRonal Inc
Technical Marketing Manager
Printed Circuit Products
Tel: (516)868 8800 ext:269

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************

ATOM RSS1 RSS2