Their process is basically a microetching process. They call it 
"CZ-treatment" and use special etchant "CZ-8100". Because the 
treatment does not contain copper oxide, they say it does not 
show "pink ring" and the bond strength is very stable after heat 
shock and moisture adsorption.

I have a copy of their paper but unfortunately it is written in 
Japanese.  To get more information, it is better to contact 
MEC Co. directly. Their fax number is, 

Fax: 81-6-488-8404

F.Kuwako
Mitsui Mining & Smelting Co. 
Copper Foil Division 
Japan 

> 
> From: Scott Westheimer
> Date: 2/5/97
> 
> Have anyone heard of a new oxide treatment or reducer from Japan called
MEC
> etch bond? Any information would be appreciated.
> 
> 

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************