Try J-STD-013, Implementation of Ball Grid Array and other High Density 
Technology.  It is available through the IPC; $35 for members, $70 for 
nonmembers.

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On Tue, 4 Feb 1997, Glynn Shaw wrote:

> Greetings All.
> 
> I have a customer who is starting to place BGA's on his pcbs using an
> in-house developed CAD system. He has the BGA footprint specs from the part
> suppliers but lacks the knowledge/experience to optimize the pcb for
> assembly of these devices. He is looking for specs which will help him to
> properly design his boards to accept BGA devices-- and additionally, any
> special requirements which might be necessary for the various types of BGA
> devices (column vs ball).
> 
> 
> Any suggestions? 
> 
> Glynn Shaw, President
> Proto Engineering Corp.
> 181 Commercial St.
> Sunnyvale, Ca. 94086
> 
> email: [log in to unmask]
> phone: (408)738-0693
>   fax: (408)738-1290
> modem: (408)738-1388
> 
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