Greetings All.

I have a customer who is starting to place BGA's on his pcbs using an
in-house developed CAD system. He has the BGA footprint specs from the part
suppliers but lacks the knowledge/experience to optimize the pcb for
assembly of these devices. He is looking for specs which will help him to
properly design his boards to accept BGA devices-- and additionally, any
special requirements which might be necessary for the various types of BGA
devices (column vs ball).


Any suggestions? 

Glynn Shaw, President
Proto Engineering Corp.
181 Commercial St.
Sunnyvale, Ca. 94086

email: [log in to unmask]
phone: (408)738-0693
  fax: (408)738-1290
modem: (408)738-1388

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