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February 1997

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Subject:
Spec for inductive components
From:
[log in to unmask] (DAVY.J.G-)
Date:
Tue, 4 Feb 1997 11:24:46 -0500
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     Mike Middleton asked how other organizations handle documentation of 
     soldering for inductive components, since these devices are largely 
     ignored by conventional soldering standards.  At Northrop Grumman 
     ESSD, we have a process specification specifically for inductive 
     components.  It includes provisions for higher-melting solders and 
     attachments between lead wires and windings of various kinds.  As with 
     all our process specifications, it expresses engineering requirements 
     only, not manufacturing instructions, per MIL-STD-490, Specification 
     Practices.
     
     Gordon Davy

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