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February 1997

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Subject:
From:
Fred Atton <[log in to unmask]>
Date:
Fri, 28 Feb 1997 13:12:27 -0600
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Our Client, a leader in the Interconnect / Microelectronics / Materials 
marketplace, has a position for a knowledgeable Interconnect packaging 
engineer able to make technical capability presentations.

Do you know anyone ready to move into this career building opportunity?
Please call me or send E-mail with name and contact information.  (See 
position description below)

I very much appreciate your help.

Fred Atton

HIGH DENSITY INTERCONNECT PACKAGING ENGINEER               
                                                           
THE OPPORTUNITY - to join one of the most forward-looking companies 
in the Microelectronics / Interconnect arena.

Working with R&D Engineering, Manufacturing, and Marketing, 
will define, enhance and expand a Custom Substrate product line.  
Working with Marketing will identify potential customers and will 
make technical capability presentations to targeted audiences.  Will 
work with customers' design engineers to develop interconnects and 
integrate customer product with substrate.

Should have a Bachelor's Degree in a technical field 
and good communications and presentations skills.  
Should also have several years experience in a High 
Density Interconnect Design and Manufacturing Industry.
  
Send detailed resume to:
     
     Fred Atton
     TECHNICAL ALTERNATIVES
     6750 France Avenue South # 144
     Minneapolis, MN  55435
     Ph:       (612) 922-1103  
     FAX:      (612) 922-3726
     E-mail:   [log in to unmask]

 
    









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