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February 1997

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Subject:
FAB: planarity of pads for gold wire bond (PBGA)
From:
"Jonathan Whitcomb (757-1326)" <[log in to unmask]>
Date:
Fri, 28 Feb 97 13:51:59 EST
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   For organic chip carriers where the chip will be wire bonded to the
laminate, requirements for wire bond pad topography tend to be very
strict - nice and flat with no nodules, pits, or other imperfections.
Is a planarization step normally required?  If so, how is it done?
We don't do much acid copper pattern plate - can that be plated level
enough to wire bond on without subsequent smoothing/planarizing?


Jonathan Whitcomb
IBM Endicott

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