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                             CALL FOR PAPERS

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	THIRD ANNUAL IPC/SMTA BALL GRID ARRAY NATIONAL SYMPOSIUM
		JUNE 23-24, 1997 - BEDFORD, MASSACHUSETTS

Participate in the electronic interconnection industry's only forum 
exclusively devoted to Ball Grid Array (BGA) technology IPC and SMTA are 
co-sponsoring a two-day national event to bring industry the latest 
information on what remains the most important innovation in surface 
mount technology in the last decade.

Papers are sought in all areas including:
-- Layout and routing methods for high density BGA
-- Microvia formation and other fabrication technologies
-- Solder attachments and other materials
-- Progress on BGA standardization
-- New BGA package types
-- X-ray inspection of BGA packages
-- BGA assembly processes and process control methods
-- Repair and rework of BGA
-- Recent studies on package reliability

Presentations may be thirty, forty-five, or sixty minutes in length. Some 
presentations may be grouped together in a forum or panel discussion. 
Abstracts are due to SMTA by March 14, 1997.

Papers and presentations must be non-commercial in nature, focusing on 
technology rather than a company's product. It is mandatory to provide a 
print-quality paper or hard copies of visuals for the conference 
proceedings in order to deliver an oral presentation. The deadline for 
paper submission is April 21, 1997.

To submit an abstract, please fax your presentation title and a 200-300 
word description. Please indicate the time length or your presentation.
Abstracts can be faxed to Sue Rectenwal at SMTA at 612/926-1819 or e-mail 
[log in to unmask] For more information, please contact Sue at SMTA 
Headquarters: 612/920-7682.

Presenters at the IPC/SMTA National Conference on Ball Grid Array will 
receive full conference admission, including refreshments, lunches, and 
the proceedings at no charge.

Conference Chairperson Vern Solberg is the Director of Advanced Program 
Manufacturing Technology for Tessera, Inc., a developer of Micro Ball 
Grid Array (tm). Vern has been a specialist in electronic packaging and 
circuit board design for more than twenty-five years. An active member of 
SMTA, IPC, and the Surface Mount Council, Vern is Chiarman of the 
IPC-SM-782 SMT Land Patterns Standards Committee. He is the author of 
Design Guidelines for Surface Mount and Fine-Pitch Technology published 
by McGraw-Hill and is on the technical advisory board for SMT Magazine.

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