We performed a Formal 2 level DOE on glue bond strength and had found that
by far the most significatn factor on holding the SMD's on the board is
volume of glue.  Other factors were part profile height, time of cure, temp
of cure and operator tweaking of part after placement in glue.  I'd be
willing to share more info. with you after you have some results from your
experiment.

                                        Mark Spitnale
                                        Hughes Defense Communication
                                        (219) 429-5992



At 09:04 AM 2/28/97 -0500, you wrote:
>>Return-Path: <[log in to unmask]>
>>Resent-Date: Thu, 27 Feb 1997 16:56:01 -0800
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>>Date: Thu, 27 Feb 97 16:40:49 CDT
>>From: "Paul Stolar" <[log in to unmask]>
>>Encoding: 7 Text
>>To: [log in to unmask]
>>Subject: SMT: Glue
>>Resent-Message-Id: <"vditl1.0.73F.OkW5p"@ipc>
>>Resent-From: [log in to unmask]
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>>
>>     
>>
>>     I am preparing an experiment to determine the effects on glue dot 
>>     strength for wave applications. Intuition says that board 
>>     finish/solder mask and contamination will play into this. Has anyone 
>>     else done any experiments on this? ( I know cure schedule also has an 
>>     effect)
>>
>
----------------------------------
Mark W. Spitnale                Phone: (219) 429-5992   Fax: (219) 429-
Hughes Defense Communications                           Mail Stop: 25-31
1010 Production Road, Fort Wayne, IN 46808-4106
Email: [log in to unmask]

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