< ...various
> defects, such as, open or high resistant via, open trace, poor
> solderability, etc.
> ...

re: open vias
what size vias?
what thickness boards?
supplier test parameters?
supplier test methodology (single sided, single sided flip, double sided,
golden board, 100% netlist, what do they mean by netlist, how is it
derived?)

our worst case presently...
on one problem assy we've seen fail rate climb to 2.5 ppm defective vias
after double sided surface mount and wave solder (vs. total # vias received
not vs. # boards purchased).    This is a 10 layer 0.065 thick w/ .0135
drill, 45 holes/sq in.  Process glitched at supplier, when in control it is
parts per billion.

re: open traces
what width/spacing, inner/outer?
what's fail analysis show?

for us it's less than 10 traces out of the last $30M pwb's purchased.
mostly 8/8,  4/6/8/10 layer/.062 thick/FR4 and GY/GX.

re: solderability
what finish is on your pwb's?
what kind of solder process you running?

HASL and Fused Sn/Pb -- only had one supplier solderability problem in last
3 years with Fused Sn/Pb.  Basic bonehead chemistry monitoring oversight.
Dead issue -- learned that lesson and eliminated root cause.

Electroless Ni/Immersion Au -- stand by for pain.  There's 2 types of these
boards.  The ones you've had solderability/adhesion problems with and the
ones you're going to have problems with.  A necessary evil in some cases
though and deserving of careful process control and supplier audit.   make
sure your supplier runs a lot of this, regularly, and has lots of scar
tissue.

(my $.02)
dwight
qe: interconnect supplier quality
(i don't know nothin' i'm just a vw mechanic who got lucky)


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