Need information on applying SPC to solder thickness data from 
a hot-air-leveling solder coating process (vertical).  I would be
interested in knowing what data collection and charting methods
you are using.  We have a current system but question its validity
due to wide variety of board designs run through process (each lot
has its own design and, therefore, its own tendency toward certain
solder thicknesses at certain locations).

Thanks.


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