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February 1997

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Thu, 27 Feb 97 15:20:39 EST
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     Maximize total copper on all layers - this will minimize your etching 
     load (cost).  Use solid copper borders with 0.125" vacuum channels.  
     Use 16ga. (0.060" thk.) separator plates, preferably hardened 420SS.  
     Ensure adequate resin volume to fill the non-functional space and 
     account for this reduced volume in the overall thickness prediction.  
     Depending on your chemistry, you can probably expect 6-8 mils of line 
     width reduction (i.e., blow the .024" track up to .030"-.032").  Can 
     your photoresist withstand the required etchant exposure time?  
     Keeping pH on the low end might buy you a little extra time.  If this 
     is a high-volume program, do a mfg.cost reality check per pound of 
     etched copper.  (Cupric chloride, incidentally, etches the same for 
     roughly half the cost depending, of course on a myriad of other 
     factors).
     Good luck.
     
     J.Felts
     PC World, Toronto


______________________________ Reply Separator _________________________________
Subject: FAB: 3 layer board with 4 oz copper 
Author:  [log in to unmask] at INET
Date:    2/27/97 2:46 PM


I have 2 issues that I'd like to get some advise on.
1) Does anybody have advise on etching 4 oz copper? The traces are .024" and 
we etch with ammoniacal etchant.
2) Is there any advise on laminating a 3 layer board with 4 oz base copper 
on all layers? .062" finish thickness and the layup is at our discretion.
     
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