TECHNET Archives

February 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
FAB: 3 layer board with 4 oz copper
From:
sam mccorkel <[log in to unmask]>
Date:
Thu, 27 Feb 1997 14:42:46 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (18 lines) 
I have 2 issues that I'd like to get some advise on.
1) Does anybody have advise on etching 4 oz copper? The traces are .024" and
we etch with ammoniacal etchant.
2) Is there any advise on laminating a 3 layer board with 4 oz base copper
on all layers? .062" finish thickness and the layup is at our discretion.

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************

ATOM RSS1 RSS2