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February 1997

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Tue, 4 Feb 1997 05:49:47 -0500
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AIT has a product called ME7158 that we are presently using for space 
application and the bonding of components to PWB's.

On our standard military product we are using a Mereco product 
XLN-589.


Dave


______________________________ Reply Separator _________________________________
Subject: ASSY: THERMAL ADHESIVE
Author:  Jim Marsico 516-595-5879 <[log in to unmask]> at INTERNET
Date:    2/3/97 1:05 PM


I'm looking for a thermal adhesive to use between a component and PWB for 
thermal transfer.  Properties should be close to the following:

        Lap shear               500 psi
        thermal conductivity    4.50 BTU... FT2 (.0065 WATTS/CM C)

The material must also meet the fungus and non-nutrient requirements of 
MIL-STD-454 Requirement 4.  Reworkability is also a requirement... something 
like a one part silicon-based adhesive would be nice.

Thanks

Jim Marsico
(516) 595-5879
[log in to unmask]

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