Hi Scott,
Your supplier is absolutely right. During reflow the MLB together with the
PTVs, RCs, CCs, SOT-23s reach the highest temperature during the reflow peak
(e.g. 221C) vs. a SOIC (216C) vs. 68 PLCC lead (205C) vs. 68PLCC body/die
(196C). From the last number you can see why the leads of components are slow
to heat; they are connected to quite substantial heat sinks.

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945  USA
Phone & Fax: 201-543-2747
E-mail: [log in to unmask]

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