I have a question with regard to Resin Recession prior to thermal stress.
  Both IPC-600 and 6012 only indicate an acceptable condition after   
thermal stress.  There is no mention of the acceptability of resin   
recession after HASL.  I am looking to find any information which I could   
supply to one of my accounts that would indicate what the criteria would   
be prior to thermal stress.   MIL-P-55110 paragraph 3.6.2.1.10.1 has a   
criteria prior to thermal stress.
This product is also in excess of 175 mils thick.  We have also recently   
moved to aprox. 175 degrees C,Tg material to alleviate lifted lands but   
we are now seeing more resin recession.  Would someone at TechNet  or IPC   
be able to comment on their views or  findings for Resin Recession prior   
to thermal stress?

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