Tony:There are a couple of other approaches that may be 
viable.Instead of doing a second plate selective gold after pattern plate you 
can do a first plate gold.There are a couples of ways to do it,both are done 
as a first plate selective gold after els.Cu.				
	If there are not any plated thru holes in the gold image you can do 
the following:selective gold image,nickel/gold plate,strip film/apply film, 
image Cu pattern plate,tin plate,strip/etch.Note that this will  not add any 
additional surface Cu to the selective gold image other than the base foil.	
									
	The other approach if you need to build up copper or do plated thru 
holes in the selective gold area is to follow the same process as above	
except do a Cu/nickel/gold plate instead of just a nickel/gold.		
									
	The advantage of the first gold plate is you are applying the film 
resist directly over flat els.Cu which minimizes the problem of lamination 
and resist lift when doing the gold plate operation.The primary image for Cu 
pattern plate also overlaps up onto the selective gold image,eliminating the	
interface issues of second plate gold. 					
									
					Regards				
					Michael Barmuta
					Staff Engineer			
					Fluke Corp.			
					Everett Wa.			
					(206)356-6076


On Tue, 18 Feb 1997 09:29:29 -0800 Tony King wrote:

> From: Tony King <[log in to unmask]>
> Date: Tue, 18 Feb 1997 09:29:29 -0800
> Subject: Dry Film For Deep Gold Process
> To: technet <[log in to unmask]>
 > 
> 	How are other manufacturers coping
> with nickel/gold application when buss
> connections are not an option ? 
>   
> 
> Tony King
> Elexsys International Inc.
> Nashua N.H.
> [log in to unmask]
> 603-886-0066
> 
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