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February 1997

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Subject:
From:
Bob Metcalf <[log in to unmask]>
Date:
Mon, 03 Feb 1997 22:18:37 -0800
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IPC SM 840 C states; "When conformal coating is to be applied in a
subsequent operation, careful definition of adhesion requirements and
the required test method(s) for that conformal coating to the production
board system must be agreed upon by the printed board fabricator and
his user customer (see IPC-CC-830)."

We have found various conformal coatings perform differently with
various solder masks. We have conducted in-house testing with the two
solder mask products you mention. I would be happy to discuss our
findings with you.

Bob Metcalf
Morton Electronic Materials
714-730-8356

>>> <[log in to unmask]> 02/02/97 06:03pm >>>
Is anyone aware of compatibility guidelines for conformal coatings and
solder
masks?  Specifically urethane coating on LPI mask.  

We are going to experiment with a Conap CE1164/1163 on Dynachem
200/200M.
 Apparently, the major contributing determinant is surface tension so I
bought a kit to measure surface tension in force dynes.  I just have to
believe that some type of chart/guidelines has been created either
emperically or on a scientific basis that assures good - excellent
adhesion
provided that the mask surface tension is "some what" higher than the
coating.  

I also understand (heard) that this is not all that simple and that there are
many other process variables affecting surface tension of each
component.
 What all these variables are and how their variability influences surface
tension is also part of my quest for a good solution.

Any info on this would be greatly appreciated.

Steve Ross
803-532-7679

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