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Date: | Fri, 21 Feb 1997 07:08:52 -0500 (EST) |
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Get copies of IPC-SM-785, 'Guidelines for Accelerated Reliability Testing of
Surface Mount Solder Attachments', IPC-D-279, 'Design Guidelines for Reliable
Surface Mount Technology Printed Board Assemblies', ANSI/IPC J-STD-012,
'Implementation of Flip Chip and Chip Scale Technology', and ANSI/IPC
J-STD-013, 'Implementation of Ball Grid Array and Other High Density
Technology'.
For additional detail contact me directly.
Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ 07945 USA
Phone & Fax: 201-543-2747
E-mail: [log in to unmask]
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