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February 1997

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Thu, 20 Feb 1997 14:26:27 -0500
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     DAVE,
     
     THE ARTICLE IS AN "OLD" ONE...  CIRCUITS MANUFACTURING; MARCH 1978..
     
     THE ARTICLE IS BASED ON A REPORT GIVEN BY KRISTI JAMES (MOTOROLA) IN 
     IEEE TRANSACTIONS ON PARTS, HYBRIDS AND PACKAGING, DEC. 1977..
     
     MAURY ROSENFIELD
     HARRIS SEMICONDUCTOR


______________________________ Reply Separator _________________________________
Subject: Re[2]: Aluminum wire bond to silver component
Author:  "ddhillma" <[log in to unmask]> at smtp
Date:    2/20/97 11:44 AM


     Hi!
     
     What paper reference are you referring to? (I would like to track down 
     a copy).
     
     Dave Hillman
     Rockwell Collins
     [log in to unmask]
     
     
______________________________ Reply Separator _________________________________
Subject: Re: Aluminum wire bond to silver component
Author:  [log in to unmask] at ccmgw1
Date:    2/20/97 10:36 AM
     
     
     THE COMMON PRACTICE IN THE IC WORLD OF PLASTIC PACKAGING IS THE USE OF 
     GOLD WIRE WITH SILVER PLATED FRAMES..
     
     ALUMINUM WIRE IS TYPICALLY USED WITH GOLD, ALUMINUM, AND NICKEL..
     
     A PAPER WAS PUBLISHED YEARS AGO ON BONDING ALUMINUM TO SILVER PLATED 
     SURFACES.. THE RESULTS SHOWED SEVERE BOND STRENGTH DEGRADATION AND 
     BOND FAILURE DURING HUMIDITY TESTING.  FAILURE MODE SHIFTED FROM WIRE 
     BREAKS TO BOND LIFTS AS A RESULT OF ALUMINUM CORROSION.
     
     
______________________________ Reply Separator _________________________________
Subject: Aluminum wire bond to silver component
Author:  [log in to unmask] at smtp
Date:    2/18/97 05:52 PM
     
     
A vendor of mine attempted to wire bond using aluminum wire to a 
component with silver leads.  This seems to have resulted in an 
unstable circuit due to poor bond connections.  The circuit is a 
precision oscillator that is very sensative to phase noise and 
frequency shifts.  We have seen that bonds have been failing bond 
pull at very low levels (.6g to 1.6g) and that multiple attempts 
have to be made to get any bonds to stick at all (11 attempts to get 
2 bonds, both of which failed at under 2.6g).
     
Q: What are the risks and problems associated with using aluminum 
wire bonds to a silver contact?
     
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