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February 1997

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Subject:
Request for information on BGA, COB, FlipChip.
From:
"EDMUND-SING" <[log in to unmask]>
Date:
Thu, 20 Feb 97 08:44:19
Content-Type:
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     We are in the business of manufacturing multilayer PCBs and have 
     manufactured a few (trial run) PCBs for BGA, COB & FlipChip 
     substrates. We would like to know about the Standards, Specifications, 
     Proceedings, any other technical references,etc for inhouse 
     reliability testing implementation. We request you to send the 
     necessary details / documents / references pertaining to the above 
     subject.
     
     With best regards,
     
     
     EDMUND SING. 

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