TECHNET Archives

February 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Date:
Wed, 19 Feb 1997 20:39:39 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (26 lines)
John,
	If by Shadow you mean the graphite based direct plate system, you will go bust
if you scrub or pumice.
	Surface preparation is achieved during the micro etch process to remove Shadow 
from the copper surfaces. The boards are then rinsed and may be given an antitarnish 
treatment proir to oven dry. From there go straight into lamination.
	Bearing in mind that Shadow is a conveyorised you should be talking to 
Electrochemicals and ASI or FSL to get process and plant requirements.

	NO I AM NOT A SALESMAN, just a very satisfied Shadow user.


Roger Hammond

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************



ATOM RSS1 RSS2