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February 1997

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Subject:
From:
"Buxton, Jeff (AZ75)" <[log in to unmask]>
Date:
19 Feb 1997 10:52:50 -0600
Content-Type:
multipart/mixed
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text/plain (414 bytes) , message.txt (4 kB)
We've been getting a few of these messages bouncing at one of our E-mail   
routers. Do you know why?

Thank you,

Jeff Buxton
Honeywell, Inc.
E-mail Support

 ----------
From:  System Administrator[SMTP:[log in to unmask]]
Sent:  Wednesday, February 19, 1997 6:57 AM
To:  *ADMIN-AZ75-Exchange
Subject:  Notification: Inbound Mail Failure - Message could not be   
processed


The message that caused this notification was:






Received: from 168.113.24.64 by beowulf.cas.honeywell.com with SMTP (Microsoft Exchange Internet Mail Connector Version 4.0.994.63) id 1CXN3DY0; Wed, 19 Feb 1997 06:57:02 -0700 Received: from ipc.org by simon.ipc.org via SMTP (940816.SGI.8.6.9/940406.SGI) id HAA03077; Wed, 19 Feb 1997 07:46:09 -0800 Resent-Date: Wed, 19 Feb 1997 07:46:09 -0800 Received: by ipc.org (Smail3.1.28.1 #2) id m0vx3n1-0001PRC; Tue, 18 Feb 97 22:37 CST Resent-Sender: [log in to unmask] Old-Return-Path: <[log in to unmask]> Message-Id: <[log in to unmask]> Date: Wed, 19 Feb 1997 13:47:10 +0900 From: Motoyo Wajima <[log in to unmask]> To: Motoyo Wajima <[log in to unmask]> Cc: [log in to unmask], [log in to unmask], [log in to unmask] Subject: Re: Blind vias & fine lines In-Reply-To: <[log in to unmask]> MIME-Version: 1.0 X-Mailer: AL-Mail 1.22 Content-Type: text/plain; charset=iso-2022-jp Resent-Message-ID: <"TEm3_2.0.wd8.UEe2p"@ipc> Resent-From: [log in to unmask] X-Mailing-List: <[log in to unmask]> archive/latest/10353 X-Loop: [log in to unmask] Precedence: list Resent-Sender: [log in to unmask] Motoyo Wajima <[log in to unmask]> さんは書きました: >Mr.Hammond > > A 1:1 aspect ratio of blind via is limit. > Vibration through electroless,electro plating process and lower current > density in electro plating are very important. > Regards >Motoyo Wajima >General Purpose Computer Division,Hitachi,Ltd.(JAPAN) > > >[log in to unmask] さんは書きました: >> I've heard that the general rule limiting blind vias is a 1:1 aspect >> ratio. You are at it with the 16 mil holes & 16 mil depth. It seems >> like you are doing the right things (i.e. vibration, etc.) so I'm not >> sure what else to suggest. >> >> >> MB >>_____________________________ Reply Separator >_________________________________ >>Subject: Blind vias & fine lines >>Author: [log in to unmask] at SMTPLINK-HADCO >>Date: 2/12/97 10:07 PM >> >> >>Techneters, >> Can anyone help? I am having two problem areas: >> >> 1) Blind via holes 16 mil diameter 16 mil deep contacting with 4 >>inner layers. I cannot always plate copper into all holes. If I do copper >>plate them I cannot tin plate all the holes. I have vibrators on the >>cathode movement frame and a giant to clout the fight bars with a 2 pound >>hammer. Is there anything else I can do?!? >> >> 2) Circuits with 2 mil track and gaps. The finish required is >>electroless nickel/immersion gold. How can this be done without causing >>the tracks to short with nickel spikes? >> >> Thanks in advance, >> Roger Hammond >> >>*************************************************************************** >>* TechNet mail list is provided as a service by IPC using SmartList v3.05 * >>*************************************************************************** >>* To unsubscribe from this list at any time, send a message to: * >>* [log in to unmask] with <subject: unsubscribe> and no text. * >>*************************************************************************** >>* If you are having a problem with the IPC TechNet forum please contact * >>* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * >>*************************************************************************** >> >> >>*************************************************************************** >>* TechNet mail list is provided as a service by IPC using SmartList v3.05 * >>*************************************************************************** >>* To subscribe/unsubscribe send a message <to: [log in to unmask]> * >>* with <subject: subscribe/unsubscribe> and no text in the body. * >>*************************************************************************** >>* If you are having a problem with the IPC TechNet forum please contact * >>* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * >>*************************************************************************** >> >> *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************

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