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Subject:	Re: heat shielding
From:	Victor Li <[log in to unmask]>
Date:	Thu, 20 Feb 1997 00:49:30 +0800 (HKT)
Content-Type:	TEXT/PLAIN
Parts/Attachments:	TEXT/PLAIN (50 lines)

Hi, Phil,

What kind of components in the Thru-hole process you may want to protect?
Would you need a similar kind of protection in the SMT reflow?

Thanks in advance.

Vic

On Mon, 17 Feb 1997 [log in to unmask] wrote:

> Here's one for you.
> Some time ago, a company sent me a sample of a material they had developed
> that could be used to shield heat sensitive components during reflow.  It
> would be molded to conform to the surface geometry of the portion of the
> assembly to be protected.  I'm a bit skeptical about whether it really works
> but I'd like to try it.  It could be very beneficial for the Reflow Of
> Through-hole process applications.
> If anyone knows who this company is or where they are, please let me know.
>  I'd like to experiment with the material.
> 
> Phil Zarrow
> ITM, Inc.
> [log in to unmask]
> 
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