Hello,TechNetters!
We are performing cross sections on printed circuits for Press fit
contacts.
The procurement specification for our product is based on 
ANSI/IPC-RB-276 and IPC-A 600 revision E.
In order to follow the latest IPC specifications we intend to change
the procurement specification according to IPC-6012.
In IPC-A-600-which is an applicable document for both ANSI/IPC-RB-276
and IPC-6012
 it is stated that RESIN RECESSION is not acceptable on
boards prior to thermal stress (288C,10s).
ANSI/IPC-RB-276 describes all the defects prior and after thermal stress
too, figure 8 stating that defects in zone A shall not be evaluated 
after thermal stress. Conclusion?-They shall be evaluated before,as per
IPC-A-600.
(btw this figure appears as 3-6 on IPC-6012) 
All this-sorry-boring, but important stuff was understandable and we
followed the instructions.
Now IPC-6012 (we have only the 2nd proposal, have ordered the final )
comes riding on a white horse and says:
Thou shall not:
-Perform solderability tests on boards for press fit contacts.
-Perform evaluation of properties which are affected by thermal 
stressing.
Resin recession is one of these properties. Our boards are hot air 
reflowed as received and will never be processed at higher temperature.
We have seen resin recession on as received boards.
Is it acceptable according to the new standard which requires evaluation
only after thermal stress?

Many thanks to all who had the patience to read and answer!
Gabby

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